发明申请
- 专利标题: Integrated Circuit Package Assembly Including Wave Guide
- 专利标题(中): 集成电路封装组件包括波导
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申请号: US12748709申请日: 2010-03-29
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公开(公告)号: US20110234472A1公开(公告)日: 2011-09-29
- 发明人: Linus Maurer , Alexander Reisenzahn , Markus Treml , Thomas Wickgruber
- 申请人: Linus Maurer , Alexander Reisenzahn , Markus Treml , Thomas Wickgruber
- 申请人地址: DE Neubiberg
- 专利权人: Infineon Technologies AG
- 当前专利权人: Infineon Technologies AG
- 当前专利权人地址: DE Neubiberg
- 主分类号: H01Q1/00
- IPC分类号: H01Q1/00 ; H01L21/52
摘要:
Some embodiments herein relate to a transmitter. The transmitter includes an integrated circuit (IC) package including a first antenna configured to radiate a first electromagnetic signal therefrom. A printed circuit board (PCB) substrate includes a waveguide configured to receive the first electromagnetic signal and to generate a waveguide signal based thereon. A second antenna can be electrically coupled to the waveguide and can radiate a second electromagnetic signal that corresponds to the waveguide signal. Other devices and methods are also disclosed.
公开/授权文献
- US08169060B2 Integrated circuit package assembly including wave guide 公开/授权日:2012-05-01
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