发明申请
- 专利标题： IC PACKAGE STIFFENER WITH BEAM
- 专利标题（中）： IC封装激光束与光束
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申请号： US12729882申请日： 2010-03-23
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公开(公告)号： US20110235304A1公开(公告)日： 2011-09-29
- 发明人: Paul J. Brown , Alex L. Chan
- 申请人： Paul J. Brown , Alex L. Chan
- 申请人地址： CA Ottawa
- 专利权人： Alcatel-Lucent Canada, Inc.
- 当前专利权人： Alcatel-Lucent Canada, Inc.
- 当前专利权人地址： CA Ottawa
- 主分类号： H05K7/00
- IPC分类号： H05K7/00
摘要：
Various exemplary embodiments relate to a stiffener for use with and integrated circuit (IC). The stiffener can be attached to the IC, and can utilize a planar portion and one or more beam portions that project from the planar portion at a non-zero angle. The stiffener can alternatively include a frame formed of beam portions that are adjacent the sides of the IC. The stiffener can provide added stiffness to the IC package to resist warping of the IC during soldering.