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发明申请
US20110237164A1 POLISHING APPARATUS, POLISHING METHOD AND PRESSING MEMBER FOR PRESSING A POLISHING TOOL 有权
抛光设备，抛光方法和压制用于压制抛光工具的构件

  • 专利标题： POLISHING APPARATUS, POLISHING METHOD AND PRESSING MEMBER FOR PRESSING A POLISHING TOOL
  • 专利标题（中）： 抛光设备，抛光方法和压制用于压制抛光工具的构件
  • 申请号： US12986481
    申请日： 2011-01-07
  • 公开(公告)号： US20110237164A1
    公开(公告)日： 2011-09-29
  • 发明人: Masaya SEKI , Kenya Ito , Masayuki Nakanishi
  • 申请人： Masaya SEKI , Kenya Ito , Masayuki Nakanishi
  • 优先权： JP2010-006674 20100115; JP2010-287242 20101224
  • 主分类号： B24B1/00
  • IPC分类号： B24B1/00 ;  B24B27/00
POLISHING APPARATUS, POLISHING METHOD AND PRESSING MEMBER FOR PRESSING A POLISHING TOOL
摘要：
A polishing apparatus polishes a top edge portion and/or a bottom edge portion of a substrate accurately and uniformly. The polishing apparatus includes a rotary holding mechanism 3 configured to hold the substrate W horizontally and to rotate the substrate W; and at least one polishing head 30 disposed near the peripheral portion of the substrate. The polishing head 30 has at least one protrusion 51a, 51b extending along a circumferential direction of the substrate W, and the polishing head 30 is configured to press a polishing surface of a polishing tape 23 by the protrusion 51a, 51b against the peripheral portion of the substrate W from above or below.
摘要（中）：

抛光装置精确而均匀地抛光基板的顶边部分和/或底边部分。 抛光装置包括旋转保持机构3，其构造成水平地保持基板W并使基板W旋转; 以及设置在基板的周边部分附近的至少一个抛光头30。 抛光头30具有沿着基板W的圆周方向延伸的至少一个突起51a，51b，并且抛光头30被构造成通过突起51a，51b将抛光带23的抛光表面压靠在基板 基底W从上方或下方。

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