发明申请
- 专利标题: Copper alloy sheet, manufacturing method of copper alloy sheet, and electric/electronic component
- 专利标题(中): 铜合金板,铜合金板的制造方法以及电气/电子部件
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申请号: US12805055申请日: 2010-07-09
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公开(公告)号: US20110240180A1公开(公告)日: 2011-10-06
- 发明人: Weilin Gao , Akira Sugawara , Ryosuke Miyahara , Hisashi Suda
- 申请人: Weilin Gao , Akira Sugawara , Ryosuke Miyahara , Hisashi Suda
- 申请人地址: JP Tokyo
- 专利权人: DOWA METALTECH CO., LTD.
- 当前专利权人: DOWA METALTECH CO., LTD.
- 当前专利权人地址: JP Tokyo
- 优先权: JP2010-087120 20100405; JP2010-123756 20100531
- 主分类号: C22F1/08
- IPC分类号: C22F1/08 ; C22C9/06 ; C22C9/02 ; C22C9/04
摘要:
There is provided a copper alloy sheet including 1.0 to 3.5 mass % Ni, 0.5 to 2.0 mass % Co, and 0.3 to 1.5 mass % Si, a Co/Ni mass ratio being 0.15 to 1.5, an (Ni+Co)/Si mass ratio being 4 to 7, and a balance being composed of Cu and an unavoidable impurity, wherein in observation results of a crystal grain boundary property and crystal orientation by EBSP measurement, a density of twin boundaries among all crystal grain boundaries is 40% or more and an area ratio of crystal grains with Cube orientation is 20% or more, on a rolled surface.
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