发明申请
US20110240355A1 PRINTED CIRCUIT BOARD UNIT, ELECTRONIC DEVICE AND METHOD OF FABRICATING PRINTED CIRCUIT BOARD
审中-公开
印刷电路板单元,电子设备及制作印刷电路板的方法
- 专利标题: PRINTED CIRCUIT BOARD UNIT, ELECTRONIC DEVICE AND METHOD OF FABRICATING PRINTED CIRCUIT BOARD
- 专利标题(中): 印刷电路板单元,电子设备及制作印刷电路板的方法
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申请号: US13071693申请日: 2011-03-25
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公开(公告)号: US20110240355A1公开(公告)日: 2011-10-06
- 发明人: Naoki NAKAMURA , Nobuo TAKETOMI , Kiyoyuki HATANAKA , Shigeo IRIGUCHI
- 申请人: Naoki NAKAMURA , Nobuo TAKETOMI , Kiyoyuki HATANAKA , Shigeo IRIGUCHI
- 申请人地址: JP Kawasaki-shi
- 专利权人: FUJITSU LIMITED
- 当前专利权人: FUJITSU LIMITED
- 当前专利权人地址: JP Kawasaki-shi
- 优先权: JP2010-078070 20100330
- 主分类号: H05K1/16
- IPC分类号: H05K1/16 ; H05K3/00
摘要:
A printed circuit board unit includes a printed circuit board and an electronic component. The electronic component is electrically connected to a predetermined position on the printed circuit board by means of soldering while being joined to the printed circuit board using an adhesive layer. The adhesive layer, disposed between the printed circuit board and the electronic component, partially includes a multilayer laminated region including a first reinforcement resin layer and a second reinforcement resin layer. The first reinforcement resin layer is disposed on a side of the printed circuit board, whereas the second reinforcement resin layer is disposed on a side of the electronic component. The second reinforcement resin layer has adhesive strength greater than that of the first reinforcement resin layer.