发明申请
- 专利标题： LIGHT-EMITTING DIODE CHIP AND PACKAGE STRUCTURE THEREOF
- 专利标题（中）： 发光二极管芯片及其封装结构
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申请号： US13069232申请日： 2011-03-22
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公开(公告)号： US20110241026A1公开(公告)日： 2011-10-06
- 发明人: HUNG-NAN CHEN , Wen-Hao Cheng
- 申请人： HUNG-NAN CHEN , Wen-Hao Cheng
- 申请人地址： TW Kaohsiung City
- 专利权人： Orbit Semicon LTD.
- 当前专利权人： Orbit Semicon LTD.
- 当前专利权人地址： TW Kaohsiung City
- 优先权： TW099109543 20100330
- 主分类号： H01L27/15
- IPC分类号： H01L27/15 ; H01L33/40
摘要：
A light-emitting diode chip includes a first electrode and a metal composite layer. The metal composite layer is disposed on the first electrode and has a nickel layer. Since the metal composite layer is disposed on the first electrode, the yield of the wedge bonding can be increased, and the chip damage can be avoided.
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