发明申请
- 专利标题： FORMING IN-SITU MICRO-FEATURE STRUCTURES WITH CORELESS PACKAGES
- 专利标题（中）： 形成具有无缝包装的现场微型结构
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申请号： US12755183申请日： 2010-04-06
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公开(公告)号： US20110241195A1公开(公告)日： 2011-10-06
- 发明人: Ravi K. Nalla , Mathew J. Manusharow
- 申请人： Ravi K. Nalla , Mathew J. Manusharow
- 主分类号： H01L23/34
- IPC分类号： H01L23/34 ; H01L21/60 ; H01L21/50
摘要：
Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include attaching a die to a carrier material, forming dielectric material surrounding the die, forming buildup layers in the dielectric material to form a coreless bumpless buildup package structure, and patterning the carrier material to form microchannel structures on the package structure.
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