发明申请
- 专利标题： Dummy Metal Design for Packaging Structures
- 专利标题（中）： 包装结构的虚拟金属设计
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申请号： US12750468申请日： 2010-03-30
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公开(公告)号： US20110241202A1公开(公告)日： 2011-10-06
- 发明人: Tzuan-Horng Liu , Shang-Yun Hou , Shin-Puu Jeng , Wei-Cheng Wu , Hsiu-Ping Wei , Chih-Hua Chen , Chen-Cheng Kuo , Chen-Shien Chen , Ming Hung Tseng
- 申请人： Tzuan-Horng Liu , Shang-Yun Hou , Shin-Puu Jeng , Wei-Cheng Wu , Hsiu-Ping Wei , Chih-Hua Chen , Chen-Cheng Kuo , Chen-Shien Chen , Ming Hung Tseng
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 主分类号： H01L23/485
- IPC分类号： H01L23/485
摘要：
An integrated circuit structure includes a semiconductor chip, a metal pad at a major surface of the semiconductor chip, and an under-bump metallurgy (UBM) over and contacting the metal pad. A metal bump is formed over and electrically connected to the UBM. A dummy pattern is formed at a same level, and formed of a same metallic material, as the metal pad.
公开/授权文献
- US08193639B2 Dummy metal design for packaging structures 公开/授权日：2012-06-05
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