A voice coil using a surface mount technology (SMT) to connect the voice coil and an electrode to each other, and a SMT speaker using the voice coil. A voice coil assembly includes a voice coil formed by stacking a plurality of laminated metal plates; and a flexible printed circuit board (FPCB) for impedance matching between the voice coil and an electrode terminal for connecting an external device and for connecting the voice coil to the electrode terminal. The laminated metal plates of the voice coil are connected in series or in parallel to each other. An active device is installed on the FPCB so as to amplify a signal input through the electrode terminal and to apply the signal to the voice coil. Since the voice coil is formed by stacking the laminated metal plates and is connected to the electrode terminal through the FPCB, a SMT is used to manufacture the SMT speaker, thereby improving productivity and reliability.