发明申请
- 专利标题： CONDUCTIVE PASTE AND CONDUCTIVE CIRCUIT BOARD PRODUCED THEREWITH
- 专利标题（中）： 导电胶和导电电路板生产
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申请号： US13155367申请日： 2011-06-07
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公开(公告)号： US20110260115A1公开(公告)日： 2011-10-27
- 发明人: Yoon-Jin Kim , Chang-Mo Ko , Ho-Souk Cho
- 申请人： Yoon-Jin Kim , Chang-Mo Ko , Ho-Souk Cho
- 申请人地址： KR Anyang-city
- 专利权人： LS CABLE & SYSTEM, LTD
- 当前专利权人： LS CABLE & SYSTEM, LTD
- 当前专利权人地址： KR Anyang-city
- 优先权： KR10-2008-0125247 20081210
- 主分类号： H01B1/24
- IPC分类号： H01B1/24 ; H01B1/22 ; B82Y99/00
摘要：
A conductive paste containing silver nanoparticles and a conductive circuit board provided therewith are provided. The conductive paste containing silver nanoparticles includes 15 to 50 weight % of silver nanoparticles based on a total weight of the conductive paste, the silver nanoparticles having an average particle size of 1 to 100 nm; 0.1 to 2.5 weight % of carbon nanotubes based on the total weight of the conductive paste, the carbon nanotubes having an average diameter of 2 to 40 nm; 1 to 15 weight % of a binder based on the total weight of the conductive paste; and a solvent.