发明申请
US20110260376A1 RESIN TRANSFER MOLDING DEVICE AND RESIN TRANSFER MOLDING METHOD
有权
树脂转印成型设备和树脂转印成型方法
- 专利标题： RESIN TRANSFER MOLDING DEVICE AND RESIN TRANSFER MOLDING METHOD
- 专利标题（中）： 树脂转印成型设备和树脂转印成型方法
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申请号： US13177838申请日： 2011-07-07
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公开(公告)号： US20110260376A1公开(公告)日： 2011-10-27
- 发明人: Noriya HAYASHI , Hiroshi Mizuno , Koichi Hasegawa , Kazuo Ota
- 申请人： Noriya HAYASHI , Hiroshi Mizuno , Koichi Hasegawa , Kazuo Ota
- 优先权： JP2006-215580 20060808
- 主分类号： B29C70/36
- IPC分类号： B29C70/36 ; B29C45/14
摘要：
The present invention relates to an RTM molding device designed to mold a FRP molded body by injecting a resin composition into a mold and by impregnating the molded body therewith. The resin composition is a CCP. A CCP accommodating layer is disposed adjacent to the outer side of the molded body. The layer contains the CCP. The layer is provided with a Vf limit value, the value defined by the curing characteristics of the CCP and the characteristics of dissipation of heat from the CCP into the exterior. A means for separating the molded body is disposed between the body and the layer.