[Object] To provide a conductive member which has a stable contact resistance, is difficult to be separated, and also decreases the inserting and drawing force when used for a connector.[Means to Solve Problems] A Cu—Sn intermetallic compound layer 3 and an Sn-based surface layer 4 are formed in this order on the surface of a Cu-based substrate 1 through an Ni-based base layer 2, and, furthermore, the Cu—Sn intermetallic compound layer 3 is composed of a Cu3Sn layer 5 arranged on the Ni-based base layer 2 and a Cu6Sn5 layer 6 arranged on the Cu3Sn layer 5; the Cu—Sn intermetallic compound layer 3 obtained by bonding the Cu3Sn layer 5 and the Cu6Sn5 layer 6 is provided with recessed and projected portions on the surface which is in contact with the Sn-based surface layer 4; thicknesses X of the recessed portions 7 are set to 0.05 μm to 1.5 μm, the area coverage of the Cu3Sn layer 5 with respect to the Ni-based base layer 2 is 60% or higher, the ratio of the thicknesses of the projected portions 8 to the thicknesses Y of the recessed portions 7 in the Cu—Sn intermetallic compound layer 3 is 1.2 to 5, and the average thickness of the Cu3Sn layer 5 is 0.01 μm to 0.5 μm.[Selected Drawing] FIG. 1