发明申请
US20110275179A1 PROTECTIVE TAPE JOINING METHOD AND PROTECTIVE TAPE USED THEREFOR
审中-公开
保护带接合方法及其使用的保护带
- 专利标题： PROTECTIVE TAPE JOINING METHOD AND PROTECTIVE TAPE USED THEREFOR
- 专利标题（中）： 保护带接合方法及其使用的保护带
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申请号： US13144581申请日： 2010-07-26
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公开(公告)号： US20110275179A1公开(公告)日： 2011-11-10
- 发明人: Tomohiro Oomure , Keisuke Watanabe , Masakazu Morimoto , Masayoshi Natsume , Tsutomu Shimura , Tsuyoshi Habu , Masayuki Yamamoto
- 申请人： Tomohiro Oomure , Keisuke Watanabe , Masakazu Morimoto , Masayoshi Natsume , Tsutomu Shimura , Tsuyoshi Habu , Masayuki Yamamoto
- 优先权： JP2009-177833 20090730
- 国际申请： PCT/JP2010/004752 WO 20100726
- 主分类号： H01L21/56
- IPC分类号： H01L21/56 ; C09J7/02
摘要：
Provided is an improved method of joining a protective tape having one object to suppress generation of bending of a semiconductor wafer after a back-grinding process. The protective tape is supplied toward the semiconductor wafer suction-held on a chuck table, and an intermediate sheet is supplied along an upper side of the protective tape. Then, the intermediate sheet is interposed between a joining member and the protective tape along a surface of a base material in the protective tape so as to be movable. Under this state, the joining member and the semiconductor wafer move relative to each other in a horizontal direction, whereby the protective tape is joined to a surface of the semiconductor wafer.
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