发明申请
- 专利标题： SOLID STATE IMAGING DEVICE, METHOD OF MANUFACTURING THE SAME AND CAMERA MODULE
- 专利标题（中）： 固态成像装置，其制造方法和相机模块
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申请号： US13104604申请日： 2011-05-10
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公开(公告)号： US20110285901A1公开(公告)日： 2011-11-24
- 发明人: Takashi Abe , Ryoji Suzuki , Yoshiharu Kudoh
- 申请人： Takashi Abe , Ryoji Suzuki , Yoshiharu Kudoh
- 申请人地址： JP Minato-Ku
- 专利权人： Sony Corporation
- 当前专利权人： Sony Corporation
- 当前专利权人地址： JP Minato-Ku
- 优先权： JP2006-145603 20060525
- 主分类号： H04N5/225
- IPC分类号： H04N5/225 ; H01L31/18 ; H01L27/146
摘要：
A solid-state imaging device is provided. The solid-state imaging device includes an imaging area that includes arrayed pixels having photoelectric converting units and transistor elements; and a peripheral circuit, in which a wiring line in the imaging area that is shifted based on pupil correction amount and a wiring line in the peripheral circuit that is not shifted are connected through a connection expanded portion integrally formed with one or both of the wiring lines.