发明申请
US20110286175A1 LIQUID COOLANT CONDUIT SECURED IN AN UNUSED SOCKET FOR MEMORY MODULE COOLING
有权
液体冷却液管道用于存储模块冷却的未使用的插座
- 专利标题: LIQUID COOLANT CONDUIT SECURED IN AN UNUSED SOCKET FOR MEMORY MODULE COOLING
- 专利标题(中): 液体冷却液管道用于存储模块冷却的未使用的插座
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申请号: US12785779申请日: 2010-05-24
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公开(公告)号: US20110286175A1公开(公告)日: 2011-11-24
- 发明人: Madhusudan K. Iyengar , Vinod Kamath , Howard V. Mahaney, JR. , Mark E. Steinke , Aparna Vallury
- 申请人: Madhusudan K. Iyengar , Vinod Kamath , Howard V. Mahaney, JR. , Mark E. Steinke , Aparna Vallury
- 申请人地址: US NY Armonk
- 专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址: US NY Armonk
- 主分类号: G06F1/20
- IPC分类号: G06F1/20
摘要:
An apparatus for cooling a memory module installed in a computer system includes a liquid coolant conduit that is connected to a conduit support structure having a form factor selectively securable within a first preconfigured memory module socket of the computer system in order to position the liquid coolant conduit above the first socket. A heat pipe provides direct thermal contact between the liquid conduit and a heat spreader assembly in direct thermal contact with a face of the memory module. The apparatus may include a second heat pipe and second heat spreader assembly for similarly cooling a second memory module. In alternative configurations, the apparatus may cool memory modules on opposing sides of the conduit or memory modules that are both on the same side of the conduit.