发明申请
- 专利标题： METHOD FOR FABRICATING CHIP ELEMENTS PROVIDED WITH WIRE INSERTION GROOVES
- 专利标题（中）： 用于制作带有线插入槽的芯片元件的方法
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申请号： US13103533申请日： 2011-05-09
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公开(公告)号： US20110287606A1公开(公告)日： 2011-11-24
- 发明人: Jean Brun , Dominique Vicard
- 申请人： Jean Brun , Dominique Vicard
- 申请人地址： FR Paris
- 专利权人： COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- 当前专利权人： COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- 当前专利权人地址： FR Paris
- 优先权： FR1002080 20100518
- 主分类号： H01L21/782
- IPC分类号： H01L21/782
摘要：
The invention relates to a method for fabricating chip elements provided with a groove from devices formed on a wafer. The method comprises the steps consisting in, depositing a sacrificial film on the wafer so as to leave a central part of each device exposed and to cover an edge of the device at the level of which the groove is to be formed; applying a mold on the sacrificial film; injecting a hardenable material into the mold; hardening the hardenable material; dicing the wafer between the devices; and eliminating the sacrificial film.
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