发明申请
- 专利标题: SEMICONDUCTOR INSPECTION METHOD AND DEVICE THAT CONSIDER THE EFFECTS OF ELECTRON BEAMS
- 专利标题(中): 半导体检测方法和考虑电子束影响的器件
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申请号: US13148205申请日: 2010-01-20
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公开(公告)号: US20110291009A1公开(公告)日: 2011-12-01
- 发明人: Tohru Ando , Masahiro Sasajima
- 申请人: Tohru Ando , Masahiro Sasajima
- 申请人地址: JP Tokyo
- 专利权人: Hitachi High-Technologies Corporation
- 当前专利权人: Hitachi High-Technologies Corporation
- 当前专利权人地址: JP Tokyo
- 优先权: JP2009-025496 20090206
- 国际申请: PCT/JP2010/000281 WO 20100120
- 主分类号: G01N23/00
- IPC分类号: G01N23/00 ; G21K7/00
摘要:
Disclosed is a device capable of probing with minimal effect from electron beams. Rough probing is made possible using a lower magnification than the magnification usually viewed. When target contact of semiconductor is detected, measurement position is set in the center of picture usually to move probe without moving stage. With the miniaturization, contact can be confirmed only at high magnification, although probe can be confirmed at low magnification on the contrary but it is necessary to display it in real time. Static image obtained at high magnification once is combined with image obtained at low magnification in real time from target contact required for probing and characteristic of probe to be displayed, so that probing at low magnification can be realized to reduce the effects of electron beams and obtain accurate electrical characteristics.
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