Invention Application
- Patent Title: SEMICONDUCTOR INTEGRATED CIRCUIT AND METHOD FOR FABRICATING THE SAME
- Patent Title (中): 半导体集成电路及其制造方法
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Application No.: US12831341Application Date: 2010-07-07
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Publication No.: US20110291229A1Publication Date: 2011-12-01
- Inventor: Sang-Jin BYEON , Jun-Gi Choi
- Applicant: Sang-Jin BYEON , Jun-Gi Choi
- Priority: KR10-2010-0050497 20100528
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L23/525 ; H01L21/66

Abstract:
A semiconductor integrated circuit includes: a semiconductor chip; a through-chip via passing through a conductive pattern disposed in the semiconductor chip and cutting the conductive pattern; and an insulation pattern disposed on an outer circumference surface of the through-chip via to insulate the conductive pattern from the through-chip via.
Public/Granted literature
- US08350362B2 Semiconductor integrated circuit and method for fabricating the same Public/Granted day:2013-01-08
Information query
IPC分类: