发明申请
- 专利标题： SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- 专利标题（中）： 半导体器件及其制造方法
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申请号： US13150674申请日： 2011-06-01
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公开(公告)号： US20110291244A1公开(公告)日： 2011-12-01
- 发明人: Hidehiro TAKESHIMA
- 申请人： Hidehiro TAKESHIMA
- 专利权人： ELPIDA MEMORY, INC.
- 当前专利权人： ELPIDA MEMORY, INC.
- 优先权： JP2010-126078 20100601
- 主分类号： H01L29/06
- IPC分类号： H01L29/06
摘要：
A semiconductor device includes a wiring substrate having an insulating film formed on a surface thereof, a first semiconductor chip mounted on the wiring substrate, and a second semiconductor chip stacked and mounted on the first semiconductor chip so as to form an overhang portion. The insulating film is removed from an area of the wiring substrate that faces the overhang portion.
公开/授权文献
- US08648455B2 Semiconductor device and method of manufacturing the same 公开/授权日：2014-02-11
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