发明申请
US20110291300A1 DICING SHEET-ATTACHED FILM FOR FORMING SEMICONDUCTOR PROTECTION FILM, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE USING THE SAME, AND SEMICONDUCTOR DEVICE
审中-公开
用于形成半导体保护膜的贴片连接膜，使用其制造半导体器件的方法和半导体器件
- 专利标题： DICING SHEET-ATTACHED FILM FOR FORMING SEMICONDUCTOR PROTECTION FILM, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE USING THE SAME, AND SEMICONDUCTOR DEVICE
- 专利标题（中）： 用于形成半导体保护膜的贴片连接膜，使用其制造半导体器件的方法和半导体器件
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申请号： US13147127申请日： 2010-02-10
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公开(公告)号： US20110291300A1公开(公告)日： 2011-12-01
- 发明人: Takashi Hirano , Masato Yoshida
- 申请人： Takashi Hirano , Masato Yoshida
- 优先权： JP2009-029361 20090212; JP2009-156551 20090701; JP2010-010228 20100120
- 国际申请： PCT/JP2010/000810 WO 20100210
- 主分类号： H01L29/02
- IPC分类号： H01L29/02 ; C09J7/02 ; B32B27/18 ; H01L21/50
摘要：
The present invention includes a dicing sheet-attached film for forming a semiconductor protection film (14), which protects a semiconductor element (18) mounted on a base material and positioned on the outermost side. The dicing sheet-attached film for forming a semiconductor protection film (14) comprises a protection film-forming layer (12) which is composed of a resin composition and protects a surface of the semiconductor element (18) opposite to the surface of the semiconductor element (18) mounted on the base material, and a dicing sheet (13) laminated on the protection film-forming layer.
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