Invention Application
- Patent Title: High-Frequency Module
- Patent Title (中): 高频模块
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Application No.: US13201836Application Date: 2010-02-25
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Publication No.: US20110298568A1Publication Date: 2011-12-08
- Inventor: Hiroshi Uchimura , Nobuki Hiramatsu , Kazuki Hamata
- Applicant: Hiroshi Uchimura , Nobuki Hiramatsu , Kazuki Hamata
- Applicant Address: JP Kyoto-shi, Kyoto
- Assignee: KYOCERA CORPORATION
- Current Assignee: KYOCERA CORPORATION
- Current Assignee Address: JP Kyoto-shi, Kyoto
- Priority: JP2009-042002 20090225; JP2009-218509 20090924
- International Application: PCT/JP2010/052984 WO 20100225
- Main IPC: H01P3/00
- IPC: H01P3/00

Abstract:
A high-frequency module includes a high-frequency component including a high-frequency circuit, a conductor plate including a slot, a first conductive wire, and two second conductive wires. The high-frequency component includes a signal terminal and two reference potential terminals. The signal terminal is used for at least one of input and output of a high-frequency signal. The two reference potential terminals are connected to a reference potential. The first conductive wire is connected to the signal terminal in terms of high-frequency. The first conductive wire crosses over above the slot. The two second conductive wires are connected to the two reference potential terminals in terms of high-frequency. The two second conductive wires are so disposed along the first conductive wire and do not cross over the slot. The first conductive wire and the two second conductive wires form a pair and are electromagnetically coupled to the slot.
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