发明申请
- 专利标题: Chip-Type Electronic Component
- 专利标题(中): 片式电子元件
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申请号: US13150537申请日: 2011-06-01
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公开(公告)号: US20110299221A1公开(公告)日: 2011-12-08
- 发明人: Katsuaki Higashi , Koji Matsushita , Kiyoyasu Sakurada
- 申请人: Katsuaki Higashi , Koji Matsushita , Kiyoyasu Sakurada
- 专利权人: Murata Manufacturing Co., Ltd.
- 当前专利权人: Murata Manufacturing Co., Ltd.
- 优先权: JP2010-128675 20100604
- 主分类号: H01G4/008
- IPC分类号: H01G4/008
摘要:
A chip-type electronic component with high reliability, which is able to suppress and prevent fatal damage to a ceramic body due to cracking even if a substrate with the chip-type electronic component mounted thereon undergoes a deflection. The chip-type electronic component includes a ceramic body having internal electrodes; resin electrode layers formed in a region including at least end surfaces of the ceramic body, and connected to the internal electrodes directly or indirectly and connected with the ceramic body; and plating metal layers covering the resin electrode layers, wherein the adhesion strength between the ceramic body and the resin electrode layer is higher than the adhesion strength between the resin electrode layer and the plating metal layer.
公开/授权文献
- US08687345B2 Chip-type electronic component 公开/授权日:2014-04-01