发明申请
- 专利标题: LOW PROFILE TAPE STRUCTURES
- 专利标题(中): 低剖面胶带结构
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申请号: US12797580申请日: 2010-06-09
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公开(公告)号: US20110303447A1公开(公告)日: 2011-12-15
- 发明人: Kurt Stiehl , Albert J. Golko , Scott A. Myers
- 申请人: Kurt Stiehl , Albert J. Golko , Scott A. Myers
- 主分类号: H05K1/02
- IPC分类号: H05K1/02
摘要:
Electronic devices may include electronic device structures such substrates, structures with cavities, and housing structures. Tape may be used to seal components to the surface of a substrate or within a cavity. The tape may have a nonstick polymer layer such as a layer of parylene and one or two layers of adhesive. The nonstick layer may be formed in a pattern so that some of the layer of adhesive is uncovered by the nonstick layer. The nonstick layer may be oriented so that the adhesive is interposed between the nonstick layer and a sealed component or may be oriented so that the nonstick layer is interposed between the adhesive layer and the sealed component. The component that is sealed by the tape may be an electrical component such as a dome switch or other mechanical or electrical component.
公开/授权文献
- US08440926B2 Low profile tape structures 公开/授权日:2013-05-14