Invention Application
- Patent Title: Interposer-on-Glass Package Structures
- Patent Title (中): 玻璃封装结构
-
Application No.: US12834943Application Date: 2010-07-13
-
Publication No.: US20110304999A1Publication Date: 2011-12-15
- Inventor: Chen-Hua Yu , Jing-Cheng Lin
- Applicant: Chen-Hua Yu , Jing-Cheng Lin
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K3/00 ; H05K1/11
Abstract:
A device includes an interposer including a substrate, and a first through-substrate via (TSV) penetrating through the substrate. A glass substrate is bonded to the interposer through a fusion bonding. The glass substrate includes a second TSV therein and electrically coupled to the first TSV.
Public/Granted literature
- US08411459B2 Interposer-on-glass package structures Public/Granted day:2013-04-02
Information query
