发明申请
- 专利标题: PROCESS FOR FORMING AN ELECTROACTIVE LAYER
- 专利标题(中): 形成电镀层的方法
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申请号: US13203270申请日: 2010-03-08
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公开(公告)号: US20110309360A1公开(公告)日: 2011-12-22
- 发明人: Reid John Chesterfield , Justin Butler , Paul Anthony Sant
- 申请人: Reid John Chesterfield , Justin Butler , Paul Anthony Sant
- 申请人地址: US DE Wilmington
- 专利权人: E.I. DU PONT DE NEMOURS AND COMPANY
- 当前专利权人: E.I. DU PONT DE NEMOURS AND COMPANY
- 当前专利权人地址: US DE Wilmington
- 国际申请: PCT/US2010/026467 WO 20100308
- 主分类号: H01L29/12
- IPC分类号: H01L29/12 ; H01L21/20
摘要:
There is provided a process for forming a layer of electroactive material having a substantially flat profile. The process includes: providing a workpiece having at least one active area; depositing a liquid composition including the electroactive material onto the workpiece in the active area, to form a wet layer; treating the wet layer on the workpiece at a controlled temperature in the range of −25 to 80° C. and under a vacuum in the range of 10−6 to 1,000 Torr, for a first period of 1-100 minutes, to form a partially dried layer; heating the partially dried layer to a temperature above 100° C. for a second period of 1-50 minutes to form a dried layer.
公开/授权文献
- US08778708B2 Process for forming an electroactive layer 公开/授权日:2014-07-15