发明申请
- 专利标题: MULTI-CHIP PACKAGE SEMICONDUCTOR MEMORY DEVICE
- 专利标题(中): 多芯片封装半导体存储器件
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申请号: US13159517申请日: 2011-06-14
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公开(公告)号: US20110314234A1公开(公告)日: 2011-12-22
- 发明人: Satoshi Miyazaki , Hidekazu Nasu
- 申请人: Satoshi Miyazaki , Hidekazu Nasu
- 申请人地址: JP Tokyo
- 专利权人: OKI SEMICONDUCTOR CO., LTD.
- 当前专利权人: OKI SEMICONDUCTOR CO., LTD.
- 当前专利权人地址: JP Tokyo
- 优先权: JP2010-138312 20100617
- 主分类号: G06F12/00
- IPC分类号: G06F12/00
摘要:
An MCP type semiconductor memory device having a defective cell remedy function, which enables easy design and manufacture while minimizing chip area increase, is provided. The semiconductor memory device includes memory chips and a memory controller chip that designates an address of a memory chip according to an access request received from outside and controls access to the designated address. Each memory chip includes first and second storage regions and an information holder that holds address information representing associations between addresses in the first and second storage regions. The memory controller chip includes an address translating part that performs, upon receiving a request to access a specific address in the first storage region indicated by the address information, address designation by translating the specific address in the first storage region to an address in the second storage region corresponding to the specific address based on the associations represented by the address information.
公开/授权文献
- US09070482B2 Multi-chip package semiconductor memory device 公开/授权日:2015-06-30
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