发明申请
- 专利标题： Adhesive Tape for Manufacturing Electronic Components
- 专利标题（中）： 用于制造电子元件的胶带
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申请号： US13254939申请日： 2009-03-09
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公开(公告)号： US20110318580A1公开(公告)日： 2011-12-29
- 发明人: Sung-Hwan Choi , Ki-Jeong Moon , Hae-Sang Jeon , Chang-Hoon Sim
- 申请人： Sung-Hwan Choi , Ki-Jeong Moon , Hae-Sang Jeon , Chang-Hoon Sim
- 专利权人： TORAY ADVANCED MATERIALS KOREA INC.
- 当前专利权人： TORAY ADVANCED MATERIALS KOREA INC.
- 优先权： KR10-2009-0018211 20090303
- 国际申请： PCT/KR2009/001150 WO 20090309
- 主分类号： B32B7/12
- IPC分类号： B32B7/12
摘要：
There is provided an adhesive tape for manufacturing electronic components comprising a heat-resistant substrate and an adhesive layer containing an adhesive composition disposed on the heat-resistant substrate, wherein the adhesive composition comprises a phenoxy resin, a curing agent, an energy ray curable acrylic resin and a photoinitiator, and wherein the adhesive layer is cured by heat and an energy ray.
公开/授权文献
- US09090800B2 Adhesive tape for manufacturing electronic components 公开/授权日：2015-07-28