发明申请
- 专利标题: ULTRASONIC SENSOR MODULE ATTACHING DEVICE AND ATTACHING METHOD
- 专利标题(中): 超声波传感器模块连接装置及附件方法
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申请号: US13256139申请日: 2009-06-15
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公开(公告)号: US20120000302A1公开(公告)日: 2012-01-05
- 发明人: Satoru Inoue , Yukio Nishimoto , Toru Matsumoto
- 申请人: Satoru Inoue , Yukio Nishimoto , Toru Matsumoto
- 国际申请: PCT/JP2009/002700 WO 20090615
- 主分类号: G01D21/00
- IPC分类号: G01D21/00 ; B23P11/00
摘要:
An ultrasonic sensor module attaching device and attaching method include an ultrasonic sensor module 1 having a flange 7 of which the diameter is larger than the hole diameter of a through hole 5 prepared through a bumper 4 of a vehicle; and a fixing ring plate 3 having an engaging section 3b with the flange of the ultrasonic sensor module temporarily fixed on the back of the bumper 4 and a large-diameter fixing section 3c which extends circumferentially of the engaging section and is fixed to the back of the bumper 4; thus, the necessity for positioning the fixing ring plate 3 to the hole 5 of the bumper 4 is eliminated, which can attach easily the ultrasonic sensor module 1 to the back of the bumper.
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