发明申请
- 专利标题： LIGHT-EMITTING SEMICONDUCTOR DEVICE, MOUNTED SUBSTRATE, AND FABRICATION METHOD THEREOF
- 专利标题（中）： 发光半导体器件，安装基板及其制造方法
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申请号： US13179200申请日： 2011-07-08
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公开(公告)号： US20120007119A1公开(公告)日： 2012-01-12
- 发明人: Toshio SHIOBARA , Tsutomu Kashiwagi
- 申请人： Toshio SHIOBARA , Tsutomu Kashiwagi
- 申请人地址： JP Chiyoda-ku
- 专利权人： Shin-Etsu Chemical Co., Ltd.
- 当前专利权人： Shin-Etsu Chemical Co., Ltd.
- 当前专利权人地址： JP Chiyoda-ku
- 优先权： JP2010-155362 20100708
- 主分类号： H01L33/60
- IPC分类号： H01L33/60
摘要：
A light-emitting semiconductor device includes a lead frame having lead electrodes, a reflector arranged with the lead frame, and a light-emitting semiconductor chip accommodated in the reflector and having electrodes connected to the lead electrodes by a flip-chip bonding method, wherein: a gap between the lead frame and the light-emitting semiconductor chip is filled with a cured underfill material, and a cured silicon oxide film of 0.05 to 10 μm thickness is formed covering surfaces of the light-emitting semiconductor chip and reflector.