发明申请
US20120008655A1 HEAT SINK, METHOD OF PRODUCING SAME, AND SEMICONDUCTOR LASER DEVICE 审中-公开
散热器,其制造方法和半导体激光器件

  • 专利标题: HEAT SINK, METHOD OF PRODUCING SAME, AND SEMICONDUCTOR LASER DEVICE
  • 专利标题(中): 散热器,其制造方法和半导体激光器件
  • 申请号: US13154073
    申请日: 2011-06-06
  • 公开(公告)号: US20120008655A1
    公开(公告)日: 2012-01-12
  • 发明人: Yoshiaki Niwa
  • 申请人: Yoshiaki Niwa
  • 申请人地址: JP Tokyo
  • 专利权人: SONY CORPORATION
  • 当前专利权人: SONY CORPORATION
  • 当前专利权人地址: JP Tokyo
  • 优先权: JP2010-155836 20100708
  • 主分类号: H01S3/04
  • IPC分类号: H01S3/04 B21D53/02 F28F7/00
HEAT SINK, METHOD OF PRODUCING SAME, AND SEMICONDUCTOR LASER DEVICE
摘要:
A heat sink enabled to prevent structural deterioration of an inner wall of a flow channel caused by corrosion a semiconductor laser device are provided. The heat sink includes a main body, a flow channel which is provided in the main body, and inside which a cooling medium passes through, and a passivation film covering an inner-wall surface of the flow channel.
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