发明申请
- 专利标题： DIE PACKAGE INCLUDING SUBSTRATE WITH MOLDED DEVICE
- 专利标题（中）： DIE包装，包括具有模制设备的基板
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申请号： US13246682申请日： 2011-09-27
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公开(公告)号： US20120012993A1公开(公告)日： 2012-01-19
- 发明人: Yong Liu , Zhongfa Yuan
- 申请人： Yong Liu , Zhongfa Yuan
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L21/60
摘要：
A package is disclosed. The package includes a premolded substrate having a leadframe structure, a first device attached to the leadframe structure, and a molding material covering at least part of the leadframe structure and the first device. It also includes a second device attached to the premolded substrate.
公开/授权文献
- US08525192B2 Die package including substrate with molded device 公开/授权日：2013-09-03
信息查询
IPC分类:
