Invention Application
- Patent Title: INJECTION MOLDING MACHINE
- Patent Title (中): 注塑机
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Application No.: US13241726Application Date: 2011-09-23
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Publication No.: US20120013044A1Publication Date: 2012-01-19
- Inventor: Sang Hak KIM , Han Sub HWANG
- Applicant: Sang Hak KIM , Han Sub HWANG
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd
- Current Assignee: Samsung Electronics Co., Ltd
- Current Assignee Address: KR Suwon-si
- Priority: KR2008-33080 20080410
- Main IPC: B29C45/67
- IPC: B29C45/67
Abstract:
An injection molding machine to prevent a molded piece from being separated from a mold after molds are disassembled from each other includes a first mold, a second mold assembled with the first mold to form a cavity, and a binding device or a pressing device to get a molded piece held in the first mold when the first mold and the second mold are disassembled from each other.
Public/Granted literature
- US08439664B2 Injection molding machine Public/Granted day:2013-05-14
Information query
