There are provided a multi layer circuit board and a method of manufacturing the same. The multi layer circuit board includes each of ceramic boards having wiring patterns formed and stacked thereon; and via electrodes connecting in series the wiring patterns formed in the each of the ceramic boards, wherein one of the via electrodes is formed as a via group including a plurality of via units which connect in parallel one catch pad formed on one ceramic board and another catch pad formed on ceramic boards adjacent to the one ceramic board. Since the ceramic boards are connected through the plurality of via units, the reliability of the electrical connectivity of the via electrode may be improved, and the formation of a void and the protrusion of the via electrode may be prevented.