发明申请
- 专利标题： LED LEAD FRAME AND METHOD OF MAKING THE SAME
- 专利标题（中）： LED引线框架及其制作方法
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申请号： US13187515申请日： 2011-07-21
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公开(公告)号： US20120018747A1公开(公告)日： 2012-01-26
- 发明人: ANDREW CHENG , CHIH-PI CHENG
- 申请人： ANDREW CHENG , CHIH-PI CHENG
- 申请人地址： TW New Taipei
- 专利权人： HON HAI PRECISION INDUSTRY CO., LTD.
- 当前专利权人： HON HAI PRECISION INDUSTRY CO., LTD.
- 当前专利权人地址： TW New Taipei
- 优先权： TW99123889 20100721
- 主分类号： H01L33/62
- IPC分类号： H01L33/62 ; H01L33/08 ; H01L33/52
摘要：
An LED lead frame assembly comprises a wiring board having a plurality set of positive and negative poles arranged on a top surface thereof A plurality of LED chips are disposed on the wiring board, and electrically bonded to the bus line. A transparent cover is arranged upon the wiring board and covering the LED chip and the conductive lead.
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IPC分类:
