Invention Application
- Patent Title: LED LEAD FRAME AND METHOD OF MAKING THE SAME
- Patent Title (中): LED引线框架及其制作方法
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Application No.: US13187515Application Date: 2011-07-21
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Publication No.: US20120018747A1Publication Date: 2012-01-26
- Inventor: ANDREW CHENG , CHIH-PI CHENG
- Applicant: ANDREW CHENG , CHIH-PI CHENG
- Applicant Address: TW New Taipei
- Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee Address: TW New Taipei
- Priority: TW99123889 20100721
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01L33/08 ; H01L33/52
Abstract:
An LED lead frame assembly comprises a wiring board having a plurality set of positive and negative poles arranged on a top surface thereof A plurality of LED chips are disposed on the wiring board, and electrically bonded to the bus line. A transparent cover is arranged upon the wiring board and covering the LED chip and the conductive lead.
Information query
IPC分类:
