发明申请
- 专利标题： SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME
- 专利标题（中）： 半导体模块及其制造方法
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申请号： US12897222申请日： 2010-10-04
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公开(公告)号： US20120018897A1公开(公告)日： 2012-01-26
- 发明人: Seung Wook Park , Young Do Kweon , Ju Pyo Hong
- 申请人： Seung Wook Park , Young Do Kweon , Ju Pyo Hong
- 申请人地址： KR Gyunggi-do
- 专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址： KR Gyunggi-do
- 优先权： KR1020100071506 20100723
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/50
摘要：
Disclosed herein is a semiconductor module, including: a substrate including wiring patterns formed on both sides thereof; a first device mounted on the substrate; a first molding layer made of a molding material, surrounding the first device and including via holes formed therein to interconnect with the wiring pattern formed on one side of the substrate; and a second device mounted on the first molding layer and electrically connected with the wiring pattern formed on one side of the substrate through the via holes formed in the first molding layer.
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IPC分类:
