Invention Application
- Patent Title: SUBSTRATE BONDING SYSTEM AND METHOD OF MODIFYING THE SAME
- Patent Title (中): 基板接合系统及其修改方法
-
Application No.: US12844113Application Date: 2010-07-27
-
Publication No.: US20120024456A1Publication Date: 2012-02-02
- Inventor: Yu-Liang LIN , Weng-Jin WU , Jing-Cheng LIN
- Applicant: Yu-Liang LIN , Weng-Jin WU , Jing-Cheng LIN
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Main IPC: B32B37/02
- IPC: B32B37/02 ; B30B15/34
Abstract:
The embodiments described provide apparatus and methods for bonding wafers to carriers with the surface contours of plates facing the substrates or carriers are modified either by re-shaping, by using height adjusters, by adding shim(s), or by zoned temperature control. The modified surface contours of such plates compensate the effects that may cause the non-planarity of bonded substrates.
Public/Granted literature
- US09299594B2 Substrate bonding system and method of modifying the same Public/Granted day:2016-03-29
Information query
