A thermal pad (602, 612, 622, 702, 712) formed on a Printed Circuit Board and a method (900) of formed the thermal pad (602, 612, 622, 702, 712) are provided. The thermal pad (602, 612, 622, 702, 712) comprises in its interior one or more coins (604, 614, 624, 704, 714) has a height equal to a thickness of the PCB, and is made of metal or alloy, inserted into a corresponding one of one or more plated cutouts straight through the PCB in the thermal pad, and bonded to side walls of the corresponding one of the one or more plated cutouts with a paste capable of resisting a temperature of 250° C. or above. The plurality of through via (606, 616, 626, 706, 716) are plated, and lugged with a solder mask. The thermal pad (602, 612, 622, 702, 712) has a flat top surface and a flat bottom surface, either of which is coplanar with a corresponding one of top and bottom surfaces of the PCB. A PCB having formed thereon the above thermal pad (602, 612, 622, 702, 712) is also provided.