The present invention concerns a device for molding of thermoplastic matrix composite materials or thermosetting materials. Two mold casings that are mobile relative to each other, electrically conductive material include a molding zone designed to be in contact with the material to be transformed, and an induction circuit for generating a magnetic field. The faces of one of the two mold casings are situated so as to be facing induction circuit, except for the molding zones, being coated with a shielding layer made of a non-magnetic material preventing the magnetic field from penetrating into the mold casings. The mold casings are electrically insulated from each other during the molding phase to define an air gap wherein flows the magnetic field that induces currents at the surface of the molding zones, thus localizing the heating at the interface between the molding zone and the material to be transformed.