An interposer lead provides a connection between an integrated circuit and a circuit board. The interposer lead includes a first leg for interfacing with the circuit board. The interposer lead also includes a second leg disposed generally parallel to the first leg for interfacing with an IC electrical lead extending from the integrated circuit. A connecting portion operatively connects the first leg and the second leg. The interposer lead further includes a lip extending non-parallel from the second leg for limiting movement of the IC electrical lead on the second leg.