Invention Application
- Patent Title: APPARATUS FOR SEALING A PUNCTURE BY CAUSING A REDUCTION IN THE CIRCUMFERENCE OF THE PUNCTURE
- Patent Title (中): 用于通过减少冲击力来减少冲击的装置
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Application No.: US13174049Application Date: 2011-06-30
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Publication No.: US20120027872A1Publication Date: 2012-02-02
- Inventor: Stevan Nielsen , Bodo Quint , Randolf Von Oepen , Kenneth J. Michlitsch , Gerd Seibold , Tommy Conzelmann , Ib Erling Joergensen
- Applicant: Stevan Nielsen , Bodo Quint , Randolf Von Oepen , Kenneth J. Michlitsch , Gerd Seibold , Tommy Conzelmann , Ib Erling Joergensen
- Applicant Address: IE Dublin
- Assignee: ABBOTT LABORATORIES VASCULAR ENTERPRISES, LTD.
- Current Assignee: ABBOTT LABORATORIES VASCULAR ENTERPRISES, LTD.
- Current Assignee Address: IE Dublin
- Main IPC: A61K38/39
- IPC: A61K38/39 ; A61P17/02 ; C07K14/78 ; C01G3/10 ; A61K33/00 ; A61K33/34

Abstract:
Apparatus is provided for sealing a vascular puncture by causing a reduction in the circumference of the puncture tract through delivery of a closure agent into tissue surrounding the puncture tract. A resultant inflammatory response and volumetric increase cause the tissue to swell into the puncture tract, thereby sealing it.
Public/Granted literature
- US09017376B2 Apparatus for sealing a puncture by causing a reduction in the circumference of the puncture Public/Granted day:2015-04-28
Information query
IPC分类: