发明申请
- 专利标题： ADHESIVE FILM FOR SEMICONDUCTOR ASSEMBLY
- 专利标题（中）： 用于半导体装配的粘合膜
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申请号： US13267225申请日： 2011-10-06
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公开(公告)号： US20120029117A1公开(公告)日： 2012-02-02
- 发明人: Han Nim CHOI , Ki Tae Song , Chi Seok Hwang , Hea Kyung Kim , Chang Beom Chung
- 申请人： Han Nim CHOI , Ki Tae Song , Chi Seok Hwang , Hea Kyung Kim , Chang Beom Chung
- 申请人地址： KR Gumi-si
- 专利权人： CHEIL INDUSTRIES, INC.
- 当前专利权人： CHEIL INDUSTRIES, INC.
- 当前专利权人地址： KR Gumi-si
- 优先权： KR10-2007-0122101 20071128
- 主分类号： C09J163/02
- IPC分类号： C09J163/02 ; C09J133/14 ; C09J161/10
摘要：
An adhesive film composition includes a polymer binder; a curable resin; and about 40 to about 60 wt. % of solvent, wherein the solvent is a binary solvent consisting essentially of at least a first solvent with a boiling point of about 40° C. to about 100° C. and at least a second solvent with a boiling point of about 140° C. to about 200° C.