发明申请
- 专利标题: BONDING UNIT CONTROL UNIT AND MULTI-LAYER BONDING METHOD
- 专利标题(中): 结合单元控制单元和多层联结方法
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申请号: US13260041申请日: 2010-10-27
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公开(公告)号: US20120031557A1公开(公告)日: 2012-02-09
- 发明人: Masato Kinouchi , Takayuki Goto , Takeshi Tsuno , Kensuke Ide , Takenori Suzuki
- 申请人: Masato Kinouchi , Takayuki Goto , Takeshi Tsuno , Kensuke Ide , Takenori Suzuki
- 申请人地址: JP Tokyo
- 专利权人: MITSUBISHI HEAVY INDUSTRIES, LTD.,
- 当前专利权人: MITSUBISHI HEAVY INDUSTRIES, LTD.,
- 当前专利权人地址: JP Tokyo
- 优先权: JP2009-247855 20091028
- 国际申请: PCT/JP2010/069039 WO 20101027
- 主分类号: B29C70/68
- IPC分类号: B29C70/68 ; B65C9/40
摘要:
A multi-layer bonding method of the present invention includes: forming a first bonded substrate by bonding a first substrate and an intermediate substrate in a bonding chamber; conveying a second substrate inside said bonding chamber when said first bonded substrate is arranged inside said bonding chamber; and forming a second bonded substrate by bonding said first bonded substrate and said second substrate in said bonding chamber. According to such a multi-layer bonding method, the upper-side substrate can be bonded with an intermediate substrate and then a first bonded substrate is bonded with a lower-side substrate without taking out the first bonded substrate from the bonding chamber. For this reason, a second bonded substrate can be produced at high speed and at a low cost.
公开/授权文献
- US09064910B2 Bonding unit control unit and multi-layer bonding method 公开/授权日:2015-06-23