发明申请
- 专利标题： ELECTRONIC DEVICE HOUSING
- 专利标题（中）： 电子设备外壳
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申请号： US12964915申请日： 2010-12-10
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公开(公告)号： US20120031665A1公开(公告)日： 2012-02-09
- 发明人: BIN DAI , FA-GUANG SHI
- 申请人： BIN DAI , FA-GUANG SHI
- 申请人地址： TW Tu-Cheng CN ShenZhen City
- 专利权人： HON HAI PRECISION INDUSTRY CO., LTD.,FU TAI HUA INDUSTRY (SHENZHEN) CO., LTD.
- 当前专利权人： HON HAI PRECISION INDUSTRY CO., LTD.,FU TAI HUA INDUSTRY (SHENZHEN) CO., LTD.
- 当前专利权人地址： TW Tu-Cheng CN ShenZhen City
- 优先权： CN201010244134.X 20100803
- 主分类号： H05K5/00
- IPC分类号： H05K5/00
摘要：
An electronic device housing includes a first housing and a second housing. The first housing forms a welding portion. The second housing defines a receiving groove in the periphery for receiving the welding portion. The welding portion is welded to an inner wall of the receiving groove of the second housing.
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