发明申请
- 专利标题： INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DIE PADDLE AND METHOD OF MANUFACTURE THEREOF
- 专利标题（中）： 集成电路包装系统及其制造方法
-
申请号： US13197070申请日： 2011-08-03
-
公开(公告)号： US20120032315A1公开(公告)日： 2012-02-09
- 发明人: Byung Tai Do , Arnel Senosa Trasporto , Linda Pei Ee Chua
- 申请人： Byung Tai Do , Arnel Senosa Trasporto , Linda Pei Ee Chua
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L21/56
摘要：
A method of manufacture of an integrated circuit packaging system includes: providing a package paddle having a single integral structure with a paddle central portion surrounded by a paddle peripheral portion; forming a terminal adjacent the package paddle; mounting an integrated circuit over the paddle central portion; and forming an encapsulation over the integrated circuit and the terminal, the encapsulation free of delamination with the encapsulation directly on the paddle peripheral portion.
公开/授权文献
信息查询
IPC分类:
