发明申请
- 专利标题： ELECTRONIC DEVICE HOUSING AND MANUFACTURING METHOD THEREOF
- 专利标题（中）： 电子设备外壳及其制造方法
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申请号： US12965856申请日： 2010-12-11
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公开(公告)号： US20120033357A1公开(公告)日： 2012-02-09
- 发明人: BIN DAI , FA-GUANG SHI
- 申请人： BIN DAI , FA-GUANG SHI
- 申请人地址： TW Tu-Cheng CN ShenZhen City
- 专利权人： HON HAI PRECISION INDUSTRY CO., LTD.,FU TAI HUA INDUSTRY (SHENZHEN) CO., LTD.
- 当前专利权人： HON HAI PRECISION INDUSTRY CO., LTD.,FU TAI HUA INDUSTRY (SHENZHEN) CO., LTD.
- 当前专利权人地址： TW Tu-Cheng CN ShenZhen City
- 优先权： CN201010248392.5 20100809
- 主分类号： H05K7/00
- IPC分类号： H05K7/00 ; C09J7/00 ; B29C45/14
摘要：
An electronic device housing includes a bottom housing, a support frame, and a plastic side frame. The support frame is fixed on the bottom housing to form a receiving groove between the bottom housing and the plastic side frame. The plastic side frame is integrally formed by injecting a plastic material in the receiving groove. A manufacturing method for an electronic device housing is also provided.
公开/授权文献
- US08737045B2 Electronic device housing and manufacturing method thereof 公开/授权日：2014-05-27
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