Invention Application
- Patent Title: FORMATION METHOD OF COATING
- Patent Title (中): 涂料的形成方法
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Application No.: US13204208Application Date: 2011-08-05
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Publication No.: US20120034393A1Publication Date: 2012-02-09
- Inventor: Junji Ando , Tomoo Suzuki , Tomoki Ogawa , Masahiro Suzuki , Kazuyoshi Yamakawa , Toshiya Kubo , Hiroyuki Hashitomi , Daigo Yamamoto
- Applicant: Junji Ando , Tomoo Suzuki , Tomoki Ogawa , Masahiro Suzuki , Kazuyoshi Yamakawa , Toshiya Kubo , Hiroyuki Hashitomi , Daigo Yamamoto
- Applicant Address: JP Kariya JP Osaka-shi
- Assignee: CNK Co., Ltd.,JTEKT Corporation
- Current Assignee: CNK Co., Ltd.,JTEKT Corporation
- Current Assignee Address: JP Kariya JP Osaka-shi
- Priority: JP2010-177138 20100806
- Main IPC: H05H1/24
- IPC: H05H1/24

Abstract:
A formation method of a coating that coats a coated body with the coating includes: generating cylindrical plasma in a vacuum deposition chamber as well as supplying material gas into the vacuum deposition chamber; applying pulse voltage to the coated body; and attaching a shield member that shields an uncoated member to an uncoated part where the coating of the coated body is not formed with separation spacing over a coated part where the coating is to be formed for preventing decrease of hardness of the coating in the coated part.
Public/Granted literature
- US08734913B2 Formation method of coating Public/Granted day:2014-05-27
Information query
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