发明申请
US20120038049A1 COMPONENT HAVING A VIA, AND A METHOD FOR MANUFACTURING SUCH A COMPONENT
有权
具有威盛的组件，以及用于制造这种组件的方法
- 专利标题： COMPONENT HAVING A VIA, AND A METHOD FOR MANUFACTURING SUCH A COMPONENT
- 专利标题（中）： 具有威盛的组件，以及用于制造这种组件的方法
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申请号： US12998868申请日： 2009-10-20
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公开(公告)号： US20120038049A1公开(公告)日： 2012-02-16
- 发明人: Achim Trautmann , Thorsten Mueller
- 申请人： Achim Trautmann , Thorsten Mueller
- 优先权： DE10208054765.4 20081216
- 国际申请： PCT/EP2009/063733 WO 20091020
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/768
摘要：
A component including a via for electrical connection between a first and a second plane of a substrate is provided. The substrate has a borehole having an inner wall that is coated with a conductive layer made of an electrically conductive material, an intermediate layer being disposed between the inner wall and the conductive layer. The intermediate layer includes electrically insulating SiC.
公开/授权文献
- US08405190B2 Component having a silicon carbide coated via 公开/授权日：2013-03-26