Invention Application
- Patent Title: ELECTRICAL CONNECTOR ASSEMBLY WITH HIGH SIGNAL DENSITY
- Patent Title (中): 具有高信号密度的电气连接器组件
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Application No.: US13210605Application Date: 2011-08-16
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Publication No.: US20120040560A1Publication Date: 2012-02-16
- Inventor: CHIEN-CHIUNG WANG , XUE-LIANG ZHANG , QING-MAN ZHU
- Applicant: CHIEN-CHIUNG WANG , XUE-LIANG ZHANG , QING-MAN ZHU
- Applicant Address: TW New Taipei
- Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee Address: TW New Taipei
- Priority: CN201010253655.1 20100816; CN201010253676.3 20100816
- Main IPC: H01R13/648
- IPC: H01R13/648 ; H01R24/28
Abstract:
An electrical connector comprises a PCB (220) having a front edge to be inserted into a mating receptacle. The PCB comprises a top face having a row of first mating pads (242), and an opposite bottom face having a row of second mating pads (262) and a row of third mating pads (264) behind the second row of mating pads. The first and second mating pads are compatibly fit with an SFP receptacle (120). The PCB comprises a first sub-PCB (540) having a first outer layer containing the first mating pads and an opposite second outer layer containing the second mating pads, and a second sub-PCB (560) attached to the second outer layer on an area behind the second mating pads, the second sub-PCB having a second outer layer containing the third mating pads.
Public/Granted literature
- US08475210B2 Electrical connector assembly with high signal density Public/Granted day:2013-07-02
Information query
