In a Joule heat encapsulating apparatus and an encapsulating method using the same, a panel is mounted on a stage, the panel including a thermal-hardening type sealant for surrounding and sealing a display unit formed between a first substrate and a second substrate, a heat-generating wiring overlapping the thermal-hardening type sealant, and an electric current application wiring connected to the heat-generating wiring. A cap is employed to form a sealed space, in which the panel is arranged, between the stage and the cap. An exhaustion mechanism for exhausting air in the sealed space, and a power applying mechanism connected to the electric current application wiring for supplying a current to the heat-generating wiring, are provided. As a result, a stable encapsulating structure which prevents permeation of oxygen or moisture may be easily formed.